SEMICONDUCTOR EQUIPMENT CORP.
805-529-2293
5154 Goldman Ave.
Moorpark, California
93020
, USA
Fax: 805-529-2193
Website Links: Semiconductor Equipment Corp. | About SEC | Application Notes | Aquabond | Die Expander 1810 | FOUP Cleaner | Heat Release | High Purity | Ink Jet Cover | Model 300 | Model 3100 | Model 3150 | Model 3150, | Model 3200 | Model 3250, | Model 430 | Model 450 | Model 4750 | Model 4800 | Model 830
sec manufactures manual and semiautomatic assembly, rework, handling and test equipment used in development and production of microelectronic devices for the semiconductor, hybrid and printed circuit industries. equipment ranges from flip chip die bonders, die handling equipment, rework systems, test equipment, pick and place systems, wafer and die tape to mounting equipment.
Products & Services
| Year Established | 1975 |
| Annual Sales | US$2.5 Million - US$5 Million |
Web Site Results
- Semiconductor Equipment Corporation - Semicorp.com
- ...Solder Flip Chip Bonding VCSELs Wafer Mounting Laser Diodes Gold Bumped ...wide range of manual and semiautomatic assembly, rework, handling, and test equipment used in the development
- Semiconductor Equipment Corporation - Semicorp.com
- ...Solder Flip Chip Bonding VCSELs Wafer Mounting Laser Diodes Gold Bumped ...wide range of manual and semiautomatic assembly, rework, handling, and test equipment used in the development
- Semiconductor Equipment Corporation - New Products
...Solder Flip Chip Bonding VCSELs Wafer Mounting Laser Diodes Gold Bumped ...new Nitto Denko MSA840-II Semiautomatic Wafer Mounter. The operator simply places ...thinned. This option includes a roller assembly, vacuum chuck